Industry Awards
Rewarding excellence, innovation and success
To recognize and highlight key industry achievements in advancing photonic integration through platform development, manufacturing, design, packaging and device characterization, PIC International magazine is proud to announce its PIC Awards programme.
The winners in each of the five categories will receive their awards at an evening event in Brussels in front of over 250 senior industry professionals.
The PIC Awards offer extensive branding, sponsorship and networking opportunities through online and print advertising in our publications PIC Magazine, Compound Semiconductor, www.picmagazine.net and www.compoundsemiconductor.net and of course, at the awards event itself.
With promotional coverage running from now to April 2018, any company associated with the PIC Awards will have months of coverage to the global PIC industry, it will be a fantastic opportunity to penetrate the PIC industry.
To recognize and highlight key industry achievements in advancing photonic integration through platform development, manufacturing, design, packaging and device characterization, PIC International magazine is proud to announce its PIC Awards programme.
The winners in each of the five categories will receive their awards at an evening event in Brussels in front of over 250 senior industry professionals.
The PIC Awards offer extensive branding, sponsorship and networking opportunities through online and print advertising in our publications PIC Magazine, Compound Semiconductor, www.picmagazine.net and www.compoundsemiconductor.net and of course, at the awards event itself.
With promotional coverage running from now to April 2018, any company associated with the PIC Awards will have months of coverage to the global PIC industry, it will be a fantastic opportunity to penetrate the PIC industry.
Categories
- Substrates and Materials Award
- Metrology, Test and Measurement Award
- R&D Chip Development Award
- Device Design and Packaging Award
- Fab Process Improvement Award
- High-volume Manufacturing Award
- Innovation Award
Awards Headling Sponsorship Package
€6,495 |
| Logo on awards website and conference website |
| Logo in PIC magazine awards preview issue |
| Logo on invites sent to winners and attendees |
| Logo on the front cover and words from sponsor in awards programme |
| Short welcome address to audience and presentation of an award |
| Logo on AV during awards ceremony |
| Logo on awards backdrop, where all official winners photographs will be taken |
| Logo on all email marketing of conference and awards |
| Exhibition booth for the 2 days of the PIC International Conference |
| 5 x full conference and dinner tickets |